Why Choose Us
Committed to providing solutions that stand the test of time and are worthy of trust.
our capability
| Item | Item Name | PCBA Capability | |
|---|---|---|---|
| 1 | Lead Time | Our assembly time ranges from 24 Hours to a few weeks. Please choose appropriate time option to fit your schedule and budget. Due to the complexity of how to determine the turn time of PCBA services, our policy is that turn-time begins immediately after all the parts are ready and all the PCB files (Gerber files/other PCB files, etc.,) , Centroid (Pick & Place PNP file, or XY Data or files in other formats), BOM, and all other necessary data or documents/images/photos are complete for our assembly work. | |
| 2 | Parts Source | Consigned/kitted | We prefer you supply all the parts for the PCBA services. In this case, please send us all the components with BOM file and detailed packing list indicating item number, customer or manufacturer’s part number and quantity in kit. |
| Turn-key | With our wide and powerful network of parts sourcing, we offer Turn-key PCBA service. We do not mark up on the parts cost. Considering the big price gap between different suppliers, we only source from reliable suppliers who may have no price advantages. We will always ask for your approval before making any decisions. | ||
| Partial Turn-key/Combo | This is our regular practice which you offer the main devices and components, while we source the rest for you. Just like the Turn-key service, we will ask for your approval on every details of the parts concerning price, quality and availability. | ||
| 3 | Assembly Options | We offer Surface Mount (SMT), Thru-Hole (THT) and hybrid of both. We also offer single or double-sided placement. | |
| 4 | Types of Solder | We offer both leaded and lead-free (RoHS Compliant) assembly services for our customers. Please choose one to best fit your PCB and the parts on the PCB. | |
| 5 | Stencils | We use laser cut stainless steel stencils to ensure high reliability for fine pitch and BGA components. Nano coating is available upon request. | |
| 6 | Minimum Order | Our minimum is as low as 5 pieces. We do not want you to pay for what you do not need indeed to save you money. | |
| 7 | Component Size | Passive Component: we can accept components as small as 01005, 0201,0402. | |
| BGA: We have the ability to handle BGA of 0.3mm pitch for rigid PCBs and 0.4mm for flex boards with X-ray testing. (The details can be confirmed according to the board design.) | |||
| Fine Pitch Parts: we can assemble 0.25mm fine pitch parts. | |||
| 8 | Component Package | We accept parts in Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk. | |
| 9 | Board Dimension | Min Board Size: 10mm x 10mm (Boards smaller than this size need to be panelized) | |
| Max Board Size: 250mm x 500mm | |||
| 10 | Board Shape | We can assemble boards in Rectangular, Circular and any Odd Shapes. (For shapes other than rectangle, you need to panelize the boards in an array, and add break-away rails at the two longer paralleled edges of the panelized boards to ensure that the boards can be assembled by the machine.) | |
| 11 | Board Type | Currently we handles Rigid boards mostly. As we have the ability to handle flex and rigid-flex boards, please contact us.com if your boards are of flex or rigid-flex. | |
| 12 | Repair & Rework | Repair and rework can be difficult, but we do. Our BGA reballing service with which we can safely remove the misplaced BGA, reball it and put it back on the PCB correctly. It is cost-effective. | |
| Process | Item | Batch Manufacturing Capability | |
|---|---|---|---|
| SMT (Surface Mount Technology) | Printing | Maximum PCB size that can be processed | 900*600mm² |
| Actual printing accuracy | ±25μm (6σ) | ||
| System calibration repeatability | ±10μm (6σ) | ||
| Squeegee pressure detection | Pressure closed-loop control system | ||
| SPI (Solder Paste Inspection) | Minimum detectable solder ball spacing | 100μm | |
| X-Y axis accuracy | 0.5μm | ||
| False detection rate | ≤0.1% | ||
| Placement | Component size range that can be processed | 0.30.15 mm²–200125 mm² | |
| Maximum component height that can be processed | 25.4mm | ||
| Maximum component weight that can be processed | 100g | ||
| BGA/CSP minimum ball spacing, ball diameter | 0.30mm, 0.15mm | ||
| Placement accuracy | ±22μm (3σ), ±0.05° (3σ) | ||
| PCB size range that can be processed | 5050 mm²—850560 mm² | ||
| Board thickness range | 0.3mm–6mm | ||
| Maximum board weight | 6kg | ||
| Maximum number of material types that can be placed on the line | 500 | ||
| AOI (Automated Optical Inspection) | Minimum detectable component | 1005 | |
| Detectable defect types | Wrong material, missing parts, reverse, misplacement, tombstoning, side standing, open solder, bridging, flipped | ||
| Lifted lead detection | 3D detection function | ||
| Reflow | Temperature accuracy | ±1℃ | |
| Welding protection | Nitrogen protection (residual oxygen content <3000ppm) | ||
| Nitrogen control | Nitrogen closed-loop automatic control system, ±200ppm | ||
| 3D X-Ray | Magnification | Geometric magnification 2000; System magnification 12000 | |
| Resolution | 1μm /nm | ||
| Rotation angle & tilt view | any ±45°+360° rotation | ||
| AXI (Automated X-ray Inspection) | Minimum detectable component | 1005 | |
| Minimum detectable pin spacing | 0.4mm (QFP) | ||
| Minimum detectable solder thickness | 0.0127mm | ||
| Process | Item | Batch Manufacturing Capability | |
|---|---|---|---|
| DIP (Dual In-line Package) | Pre-processing | Component automatic forming technology | Automatic component forming |
| Insertion | Insertion technology | Fully automatic insertion machine | |
| Wave soldering | Wave type | Normal wave, Selective wave | |
| Transport rail inclination angle | 4–7° | ||
| Normal wave soldering temperature accuracy | ±3℃ | ||
| Selective wave peak stability accuracy | ±0.06 mm | ||
| Welding protection | Nitrogen protection | ||
| Crimping technology | Maximum PCB size for crimping | 800*600mm² | |
| Downward pressure accuracy | ±0.02mm | ||
| Pressure range | 0-50KN | ||
| Pressure accuracy | ±2% of the standard value | ||
| Holding time | 0—9.999S | ||
| Coating technology | Maximum processable board size | 500*475*6mm³ | |
| Maximum single board weight | 5kg | ||
| Minimum nozzle diameter | 2mm | ||
| Other features | Spray pressure programmable control | ||
| ICT test | Test level | Device level test, testing hardware connection status | |
| Number of test points | >4096 points | ||
| Test content | Contact test, open/short circuit test, resistance/capacitance test, second/third level field-effect transistor test, non-powered mixed test, boundary scan chain test, powered mixed mode test | ||
| Washing | Maximum board width | 457.2mm | |
| Maximum board height | 102mm | ||
| Equipment function | Single/double hurricane jet, S-type nozzle, air knife | ||
| Process | Item | Batch Manufacturing Capability | |
|---|---|---|---|
| Assembly and Testing | Product Series | Server Products | Small Base Station, ODU |
| Communication Products | Communication motherboards, backplanes | ||
| Medical Products | CT, CT probe, ultrasound, color ultrasound, medical monitor | ||
| FT Testing | Test Levels | Circuit board system level test, test system function status | |
| temperature cycle test | Temperature Range | -60℃-125℃ | |
| Temperature Rate | ＞10℃/min | ||
| Temperature Deviation | ≤2℃ | ||
| Other reliability analysis tests | Aging, drop, vibration, abrasion resistance, key life test, etc. | ||
| Management tools/software | IMS | Assisting warehouse, stock preparation team and production in material management | |
| MES | Manufacturing execution sysItemtem, mainly used for production process control, ECN execution control, anti-defective control, data traceability, etc. | ||
| Oracle | Purchasing process, cost, finance, work order planning, etc. management | ||
| ECN System | ECN management system to avoid missed ECNs and respond quickly to engineering change projects | ||
| Labview | Provide a graphical programming environment to enhance the data acquisition, analysis, monitoring and management capabilities of the equipment and instruments in the manufacturing process, and at the same time make the communication between the terminal computers closer and facilitate the construction of the system. | ||