Our PCB Capabilities
| Advanced PCB and Standard PCB | |||
|---|---|---|---|
| Item | Advanced PCB | Standard PCB | |
| Application | HIGH-END, COMPLEX | INEXPENSIVE, FAST | |
| Ideal For | Industrial equipments, instrumentation, automotive electronics, communication equipments | Children’s toys, small appliances, home lighting, functional testing, electronic enthusiasts | |
| Engineering | Senior engineer (one file/6 hours) | mid-level engineer (5 files/hours) | |
| Production | individual working panel | mixed working panel | |
| Quantity | ≥1 piece | 5,10,15,20,25…pieces | |
| Material | Lead-free/Halogen-free EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | ||
| High speed Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | |||
| High Frequency Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |||
| Other Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | |||
| Surface Finishing | Spray Tin, Electroless Nickel Gold, Electroless Tin, OSP, Electroless Silver, Gold Finger, Electroless Hard / Soft Gold, Selective OSP, Electroless Nickel Palladium Gold | ||
| Ink, Soldermasks | Meet IPC4101 class B/L, Rohm&Haas, TAIYO, Kuangshun, Meet IPC-SM-840 class T | Meet IPC4101 class B/L, TAIYO, Kuangshun, Meet IPC-SM-840 class T | |
| Plating | PTH (Hole copper thickness≥20um), IPC 3(25um) | PTH（Hole copper thickness≥18um） | |
| Soldermask Offset | ±2mil | ±3mil | |
| Dimensional Deviation | ±0.13mm | ±0.2mm | |
| Warping Angle | 0.75% | 1% | |
| Test Method | A.O.I, Kelvin Four-terminal sensing, Microsection Inspection, Solderability Test, Impedance Test… | A.O.I., Fly Probe Testing | |
| Glass Transition ℃ | >140℃ | >130℃ | |
| Package | Humidity indicator cards | None | |
| Inspection Report | Inspection report | None | |
| Standard | IPC Class 2, IPC Class 3, Automotive Standard, Customer Standard | IPC Class 2 | |
| Etched Line | Forbid to repair tracks(IPC 3, Automotive, Customer Standard) | – | |
| Cleanliness | Cleanliness requirements beyond those of IPC | Meet IPC standards | |
| Certification | UL, ISO9001:2008, ISO14001:2004, ISO/TS16949:2009, RoHS etc. | UL, ISO9001:2015, RoHS etc. | |
| Layers | 120L | 2~68L | |
| Maximum plate thickness | 14mm（551mil） | 10mm（394mil） | |
| Minimum line width spacing internal layer | 2.0mil/2.0mil | ||
| Minimum line width spacing Outer layer | 2.2/2.2mil | 2.5/2.5mil | |
| Counterpart Same sheet alignment | ±20um | ±25um | |
| Counterpart Interlayer alignment | ±4mil | ±5mil | |
| Maximum copper thickness | 30Oz | 6Oz | |
| Hole Diameter Mechanical drilling | ≥0.1mm(4mil) | ≥0.15mm(6mil) | |
| Hole Diameter Laser drilling | 0.050mm（2mil） | 0.1mm（4mil） | |
| Maximum Size Veneer | 1000mmX600mm | 850mmX570mm | |
| (Finished size) Backplane | 1320mmX600mm | 1250mmX570mm | |
| Thickness-to-diameter ratio Veneer | 28:01:00 | 20:01 | |
| (Finished Hole Diametr) Backplane | 35:01:00 | 25:01:00 | |
| Rapid PCB Prototyping | ||
|---|---|---|
| PCB Order Quantity (m2) | Original Lead Time (Days) | Current Lead Time (Hours) |
| 0- 50 pcs & < 1m2 | 2 – 3 Days | 24 Hours |
| 1m2 – 5m2 | 5 – 6 Days | 3 – 4 Days |
| 5m2 – 10m2 | 6 – 7 Days | 4 – 5 Days |
| More than 10m2 | 8 – 10 Days | 5 – 6 Days |